Thermal Paste (0.5 g)

This high-quality thermal paste is designed to improve heat transfer between components, especially in 3D printers and electronics.

Key features:

• Volume: 0.5 g
• Thermal conductivity: 4.8 W/m·K
• Color: Gray
• Electrically non-conductive
• Operating temperature range: -50 °C to 200 °C
• Specific gravity: >1.6 g/cm³

Use cases:

The paste is ideal for application between:

• Heatbreak and hotend heatsink in 3D printers
• CPU and heatsink in computers
• Power components and heatsinks in electronics

Application:

1. Clean the surfaces you want to join
2. Apply a thin layer of paste to one surface
3. Press the components together
4. The paste will spread evenly and fill microscopic irregularities

Benefits:

• Significantly improves heat dissipation
• Extends component lifespan
• Easy to apply
• Long-term property stability

This thermal paste is an essential helper for anyone involved in 3D printing, PC building, or working with electronics. It ensures optimal heat transfer and protects your devices from overheating.